Technology trend newsPassive Component
Coils and Inductors
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| 제품명 | 제조사 | 설명 | 상세보기 | ||||||
| Power Inductor | Chilisin | · High efficiency · Excellent Q, RDC and saturation current · Low profile and miniature size: 160808 |
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| Power Inductor | KEMET | · Composite metal core · Low RDC · Low losses at higher switching frequencies · Higher current, power and saturation |
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| Power Inductor | EPCOS | · High rated current · Low RDC · Ferrite drum core with a copper wire winding |
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| Chip inductor | Chilisin | · High Q factor and SRF value · Tight tolerance · Wide inductance range |
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| Chip inductor | KEMET | · Small size wound with low RDC: -40℃ ~ +150℃ · Dimensionless on mountablility · Multilayer high Frequency: low resistance, excellent Q, SRF · Smallest mH inductors in the world |
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| Chip inductor | EPCOS | · Very good RF characteristics · High resonant frequency · Tight inductance tolerance · Extremely high reliability |
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| Bead | Chilisin | · Available in various size, frequency and impedance · Highly resistant against heat and humidity |
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| Data and Signal line chokes | EPCOS | · Interference suppression on data line · Minimize differential-mode interference · Minimize common-mode interference · Automotive bus system: CAN, FlexRay |
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| Power line chokes | KEMET | · Compact size, low profile and light weight · Variety of form factors and heights · Split and non-split bobbin design |
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| Power line chokes | EPCOS | · Low power dissipation · Compact design · Suppression of broadband interference |
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| Transponder coil | EPCOS | · High sensitivity · AEC-Q200 · RoHS-compatible |
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| Common mode choke | Chilisin | · Multilayer construction for common-mode suppression · Excellent solderability · Compact design |
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